Criteria are applied to both the primary and secondary sides of the PCB. It covers acceptability requirements for cleanliness of assemblies with any electrical interfacing surfaces. This module identifies potential loss of metallization on SMT chip resistors, leaded and leadless devices, ceramic chip carriers, and damage to connectors, relays, press-fit and backplane connector pins and threaded hardware. ![]() ![]() It defines soldering anomalies common to SMT and Through-Hole connections using either tin-lead or lead-free solder.Īlso addressed are the high voltage criteria specified in procurement documentation for wires and leads attached to terminals, bare wires and through-hole connections. Module 2 addresses IPC Soldering Acceptability Requirements. Module 1 introduces the IPC-610H, product quality definitions, terms and definitions, requirements and flowdown, personnel proficiency and inspection methodology. Module 1: Introduction, Forward, Applicable Documents and Handling (Required) IPC CIS Policies and Procedures Version 7.3 defines the IPC Mission Statement, Interpretation of Policies and Procedures, Prerequisites and Fees, Assessment Methods, and IPC Certification Terms. Introduction: IPC CIS Policies and Procedures (Required) The document defines the latest IPC acceptance criteria for class 1 and 2 electronic assemblies. IPC-610H is the most widely used document for electronic assembly. IPC-A-610H - Acceptability of Electronic Assemblies
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |